EPC2007
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EPC2007
| Manufacturer | EPC |
|---|---|
| Description | TRANS GAN 100V 6A BUMPED DIE |
| Category | Discrete Semiconductor Products |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Vgs(th) (Max) @ Id | 2.5V @ 1.2mA |
| Vgs (Max) | +6V, -5V |
| Technology | GaNFET (Gallium Nitride) |
| Supplier Device Package | Die Outline (5-Solder Bar) |
| Series | eGaN® |
| Rds On (Max) @ Id, Vgs | 30 mOhm @ 6A, 5V |
| Power Dissipation (Max) | - |
| Packaging | Original-Reel® |
| Package / Case | Die |
| Other Names | 917-1015-6 |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Input Capacitance (Ciss) (Max) @ Vds | 205pF @ 50V |
| Gate Charge (Qg) (Max) @ Vgs | 2.8nC @ 5V |
| FET Type | N-Channel |
| FET Feature | - |
| Drive Voltage (Max Rds On, Min Rds On) | 5V |
| Drain to Source Voltage (Vdss) | 100V |
| Detailed Description | N-Channel 100V 6A (Ta) Surface Mount Die Outline (5-Solder Bar) |
| Current - Continuous Drain (Id) @ 25°C | 6A (Ta) |
| RFQ | |
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Introduce of EPC2007
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