FDB3632_SB82115
FDB3632_SB82115
Manufacturer | AMI Semiconductor / ON Semiconductor |
---|---|
Description | INTEGRATED CIRCUIT |
Category | Discrete Semiconductor Products |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Vgs(th) (Max) @ Id | 4V @ 250µA |
Vgs (Max) | ±20V |
Technology | MOSFET (Metal Oxide) |
Supplier Device Package | D²PAK (TO-263AB) |
Series | PowerTrench® |
Rds On (Max) @ Id, Vgs | 9 mOhm @ 80A, 10V |
Power Dissipation (Max) | 310W (Tc) |
Packaging | Bulk |
Package / Case | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
Operating Temperature | -55°C ~ 175°C (TJ) |
Mounting Type | Surface Mount |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 6000pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs | 110nC @ 10V |
FET Type | N-Channel |
FET Feature | - |
Drive Voltage (Max Rds On, Min Rds On) | 6V, 10V |
Drain to Source Voltage (Vdss) | 100V |
Detailed Description | N-Channel 100V 12A (Ta), 80A (Tc) 310W (Tc) Surface Mount D²PAK (TO-263AB) |
Current - Continuous Drain (Id) @ 25°C | 12A (Ta), 80A (Tc) |
RFQ |
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