APA502-60-001
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APA502-60-001
| Kaihanga | Astec America (Artesyn Embedded Technologies) |
|---|---|
| Whakaahuatanga | PAD THERMAL SIZE60 FOR AMPSS MOD |
| Kāwai | Ngä Mea Mana - Poari Poari |
| Whakahaere Toko Whakahaere / RoHS Tūnga | Kāore e hāngai / Kāore e hāngai |
| Raupapa | AMPSS® |
| Taumata Whakaaro Moe (MSL) | 1 (Unlimited) |
| Te Tae Kaituku Taeke | 12 Weeks |
| Whakahaere Toko Whakahaere / RoHS Tūnga | Not applicable / Not applicable |
| Mo te Whakamahia me te / Products Related | AMPSS® |
| Momo Accessory | Thermal Pads |
| RFQ | |
Te Aatau1 (I nga Utu US)
I roto i te taonga:7395
- 50 pcs$2.334
Ko nga utu o runga ake nei he mea motuhake mo nga taake me nga utu kaipuke. Ko te utu tika kei raro i te tuku whakamutunga
Tonoa Uiui
Nga Hua e pa ana ki APA502-60-001
-
WhakaahuaTau WaeKaihangaWhakaahuatangaTiro -
APA503-00-001Astec America (Artesyn Embedded Technologies)STUD MTG TAPPED FOR HEATSINKRFQ -
APA501-80-004Astec America (Artesyn Embedded Technologies)HEATSINK (80) 115X59X22.5MM HORZRFQ -
APA501-60-005Astec America (Artesyn Embedded Technologies)HEATSINK (60) 57.5X59X37MM VERTRFQ -
APA600-BGG456MicrosemiIC FPGA 356 I/O 456BGARFQ -
APA501-80-002Astec America (Artesyn Embedded Technologies)HEATSINK (80) 115X59X15MM HORZRFQ -
APA600-BG456IMicrosemiIC FPGA 356 I/O 456BGARFQ -
APA503-00-008Astec America (Artesyn Embedded Technologies)STUD MTG SOLDER FOR HEATSINK LPRFQ -
APA501-60-007Astec America (Artesyn Embedded Technologies)HEATSINK (60)57.2X89X12MM LO PRORFQ -
APA501-80-005Astec America (Artesyn Embedded Technologies)HEATSINK (80) 115X59X37MM VERTRFQ -
APA501-80-006Astec America (Artesyn Embedded Technologies)HEATSINK (80) 115X59X37MM HORZRFQ -
APA503-00-007Astec America (Artesyn Embedded Technologies)STUD MTG TAPPED FOR HEATSINK LPRFQ -
APA501-80-007Astec America (Artesyn Embedded Technologies)HEATSINK (80)115.6X89X12MM LOPRORFQ -
APA501-60-006Astec America (Artesyn Embedded Technologies)HEATSINK (60) 57.5X59X37MM HORZRFQ -
APA504-00-001Astec America (Artesyn Embedded Technologies)SOCKET SPRING(20-CONTROL/15-PWR)RFQ -
APA501-80-001Astec America (Artesyn Embedded Technologies)HEATSINK (80) 115X59X15MM VERTRFQ -
APA503-00-002Astec America (Artesyn Embedded Technologies)STUD MTG SOLDER FOR HEATSINKRFQ -
APA600-BG456MicrosemiIC FPGA 356 I/O 456BGARFQ -
APA502-80-001Astec America (Artesyn Embedded Technologies)PAD THERMAL SIZE80 FOR AMPSS MODRFQ -
APA501-80-003Astec America (Artesyn Embedded Technologies)HEATSINK (80) 115X59X22.5MM VERTRFQ -
APA600-BG456MMicrosemiIC FPGA 356 I/O 456BGARFQ
Tuhinga o mua
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Kupu matua mo APA502-60-001
- Astec America (Artesyn Embedded Technologies) APA502-60-001
- APA502-60-001 Rau Raraunga APA502-60-001
- APA502-60-001 datasheet
- APA502-60-001 PDF Datasheet
- Download APA502-60-001 datasheet
- Whakaahua APA502-60-001
- APA502-60-001 Wahanga
- Artesyn APA502-60-001
- Artesyn Embedded Technologies APA502-60-001
- Artesyn Technologies APA502-60-001
- Astec America (Artesyn Embedded Technologies) APA502-60-001
- Astec America (Artesyn Embedded Technologies) APA502-60-001
- Astec America, Inc APA502-60-001
- Astec America, Inc APA502-60-001
- Emerson Embedded Power (Artesyn Embedded Technolog APA502-60-001